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Korean media: Hanmi Semiconductor is expected to complete the development of wafer cutting equipment in the second half of this year

05/12/2022 HANMI Semiconductor, Wafer Cutting Equipment, Micro SAW Equipment

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　　According to Korean media IT News, HANMI Semiconductor is developing wafer cutting equipment monopolized by Japanese companies, which is expected to shorten the equipment delivery cycle and solve semiconductor supply problems.

　　According to the report, Hanmi Semiconductor aims to complete the development in the second half of 2022, of which an important part of the technology development has been completed.

　　It is understood that in June 2021, Hanmi Semiconductor used its own technology to localize micro SAW equipment. Recently, Hanmi Semiconductor has invested in facilities to increase production capacity by more than 25%. The investment is aimed at shortening lead times compared to Japanese equipment makers. The lead time for Hanmi Semiconductor's micro SAW equipment is less than half that of Japanese products.

　　The relevant person in charge of Hanmi Semiconductor said that the competition in the wafer cutting equipment market is very fierce. If the company is competitive in all aspects such as price and delivery time, the company will be able to create enough market opportunities.

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